Acidic texturing of multicrystalline silicon wafers
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Marstein, Erik Stensrud
Deputy Head of Department
In this paper, results from investigations of acidic texturing are
presented. As-cut, multicrystalline and polished, single crystal Si
wafers have been etched in a range of acidic mixtures. The mixtures
contained hydro-fluoric and nitric acid, with de-ionized water,
phosphoric acid or sulphuric acid added as diluents. In the initial
phases of the etching process, surface cracks originat-ing from the
wafer cutting were transformed into deep and elongated pits. The
reflectance of such textures was low. However, as the etching proceeded
beyond the damaged region, more reflective, bubble-like tex-tures were
obtained.
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